Tablet Reliability Test
A Tablet Computer, also known as a Tablet Personal Computer (Tablet PC), is a small, portable personal computer that uses a touch screen as its basic input device. It is an electronic product with strong mobility, and it can be seen everywhere in life (such as waiting stations, trains, high-speed trains, cafes, restaurants, meeting rooms, suburbs, etc.). People carry only simple coat protection or even no, in order to facilitate use, the design reduces the size, so that it can be directly placed in the pocket or handbag, backpack, but the tablet computer in the process of moving will also experience many environmental physical changes (such as temperature, humidity, vibration, impact, extrusion, etc.). Etc.) and natural damage (such as ultraviolet light, sunlight, dust, salt spray, water droplets... It will also cause artificial unintentional injury or abnormal operation and misoperation, and even cause failure and damage (such as: household chemicals, hand sweating, falling, terminal insertion and removal too much, pocket friction, crystal nails... These will shorten the life of the tablet computer, in order to ensure the reliability of the product and extend the service life to improve, we must carry out a number of environmental reliability test projects on the tablet computer, the following relevant tests for your reference.
Environmental test project description:
Simulate various harsh environments and reliability assessments used by tablet computers to test whether their performance meets the requirements; It mainly includes high and low temperature operation and high and low temperature storage, temperature and condensation, temperature cycle and shock, wet and heat combination test, ultraviolet, sunlight, drip, dust, salt spray and other tests.
Operating temperature range: 0℃ ~ 35℃/5% ~ 95%RH
Storage temperature range: -10℃ ~ 50℃/10% ~ 90%RH
Operating low temperature test: -10℃/2h/ power operation
Operating high temperature test: 40℃/8h/ all running
Storage low temperature test: -20℃/96h/ shutdown
Storage high temperature test: 60℃/96h/ shutdown
High temperature test of vehicle storage: 85℃/96h/ shutdown
Temperature shock: -40℃(30min)←→80℃(30min)/10cycle
Wet heat test: 40℃/95%R.H./48h/ power standby
Hot and humid cycle test: 40℃/95%R.H./1h→ramp:1℃/min→-10℃/1h, 20cycles, power standby
Wet heat test: 40℃/95%R.H./48h/ power standby
Hot and humid cycle test: 40℃/95%R.H./1h→ramp:1℃/min→-10℃/1h, 20cycles, power standby
Weather resistance test:
Simulation of the most severe natural conditions, solar thermal effect test, each cycle of 24 hours, 8 hours of continuous exposure, 16 hours to keep dark, each cycle radiation amount of 8.96 kWh/m2, a total of 10cycles.
Salt spray test:
5% sodium chloride solution/Water temperature 35°C/PH 6.5~7.2/24h/ Shutdown → Pure water wipe shell →55°C/0.5h→ Function test: after 2 hours, after 40/80%R.H./168h.
Dripping test: According to IEC60529, in line with IPX2 waterproof rating, can prevent water droplets falling at an Angle of less than 15 degrees from entering the tablet computer and causing damage. Test conditions: water flow rate 3mm/min, 2.5min at each position, checkpoint: after test, 24 hours later, standby for 1 week.
Dust Test:
According to IEC60529, in line with the IP5X dust class, can not completely prevent the entry of dust but does not affect the device should be the action and anquan, in addition to tablet computers are currently many personal mobile portable 3C products commonly used dust standards, such as: mobile phones, digital cameras, MP3, MP4... Let's wait.
Conditions:
Dust sample 110mm/3 ~ 8h/ test for dynamic operation
After the test, a microscope is used to detect whether dust particles will enter the interior space of the tablet.
Chemical staining test:
Confirm the external components related to the tablet, confirm the chemical resistance of household chemicals, chemicals: sunscreen, lipstick, hand cream, mosquito repellent, cooking oil (salad oil, sunflower oil, olive oil... Etc.), the test time is 24 hours, check the color, gloss, surface smoothness... Etc., and confirm whether there are bubbles or cracks.
Mechanical test:
Test the strength of the mechanical structure of the tablet computer and the wear resistance of the key components; Mainly includes vibration test, drop test, impact test, plug test, and wear test... Etc.
Fall test: The height of 130cm, free fall on the smooth soil surface, each side fell 7 times, 2 sides a total of 14 times, tablet computer in standby state, each fall, the function of the test product is checked.
Repeated drop test: the height of 30cm, free drop on the smooth dense surface of 2cm thickness, each side fell 100 times, each interval of 2s, 7 sides a total of 700 times, every 20 times, check the function of the experimental product, tablet computer is in the state of power.
Random vibration test: frequency 30 ~ 100Hz, 2G, axial: three axial. Time: 1 hour in each direction, for a total of three hours, the tablet is in standby mode.
Screen impact resistance test: 11φ/5.5g copper ball fell on the center surface of 1m object at 1.8m height and 3ψ/9g stainless steel ball fell at 30cm height
Screen writing durability: more than 100,000 words (width R0.8mm, pressure 250g)
Screen touch durability: 1 million, 10 million, 160 million, 200 million times or more (width R8mm, hardness 60°, pressure 250g, 2 times per second)
Screen flat press test: the diameter of the rubber block is 8mm, the pressure speed is 1.2mm/min, the vertical direction is 5kg force flat press the window 3 times, each time for 5 seconds, the screen should display normally.
Screen front flat press test: The entire contact area, the direction of the vertical 25kg force front flat press each side of the tablet computer, for 10 seconds, flat press 3 times, there should be no abnormal.
Earphone plug and remove test: Insert the earphone vertically into the earphone hole, and then pull it out vertically. Repeat this for more than 5000 times
I/O plug and pull test: The tablet is in standby state, and the plug terminal connector is pulled out, a total of more than 5000 times
Pocket friction test: Simulate various materials pocket or backpack, the tablet is repeatedly rubbed in the pocket 2,000 times (friction test will also add some mixed dust particles, including dust particles, yan grass particles, fluff and paper particles for mixing test).
Screen hardness test: hardness greater than class 7 (ASTM D 3363, JIS 5400)
Screen impact test: hit the most vulnerable sides and center of the panel with a force of more than 5㎏
Laptop Test Conditions
Notebook computer from the early 12-inch screen evolution to the current LED backlit screen, its computing efficiency and 3D processing, will not be lost to the general desktop computer, and the weight is becoming less and less burden, the relative reliability test requirements for the entire notebook computer is becoming more and more stringent, from the early packaging to the current boot down, the traditional high temperature and high humidity to the current condensation test. From the temperature and humidity range of the general environment to the desert test as a common condition, these are the parts that need to be considered in the production of notebook computer related components and design, the test conditions of the relevant environmental tests collected so far are organized and shared with you.
Keyboard tapping test:
Test one:
GB:1 million times
Key pressure :0.3~0.8(N)
Button stroke :0.3~1.5(mm)
Test 2: Key pressure: 75g(±10g) Test 10 keys for 14 days, 240 times per minute, a total of about 4.83 million times, once every 1 million times
Japanese manufacturers :2 to 5 million times
Taiwan manufacturer 1: more than 8 million times
Taiwan Manufacturer 2:10 million times
Power switch and connector plug pull test:
This test model simulates the lateral forces that each connector can withstand under abnormal usage. General laptop test items: USB, 1394, PS2, RJ45, Modem, VGA... Equal application force 5kg(50 times), up and down left and right pull and plug.
Power switch and connector plug test:
4000 times (Power supply)
Screen cover opening and closing test:
Taiwanese manufacturers: open and close 20,000 times
Japanese manufacturer 1: opening and closing test 85,000 times
Japanese manufacturer 2: opening and closing 30,000 times
System standby and recovery switch test:
General note type: interval 10sec, 1000cycles
Japanese manufacturer: System standby and recovery switch test 2000 times
Common causes of laptop failure:
☆ Foreign objects fall on the notebook
☆ Falls off the table while in use
☆ Tuck the notebook in a handbag or trolley case
☆ Extremely high temperature or low temperature ☆ Normal use (overuse)
☆ Wrong use in tourist destinations
☆PCMCIA inserted incorrectly
☆ Place foreign objects on the keyboard
Shutdown drop test:
General notebook type :76 cm
GB package drop: 100cm
Us Army and Japanese notebook computers: The height of the computer is 90 cm from all sides, sides, corners, a total of 26 sides
Platform :74 cm (packing required)
Land: 90cm (packing required)
TOSHIBA&BENQ 100 cm
Boot drop test:
Japanese :10 cm boot fall
Taiwan :74 cm boot fall
Laptop main board temperature shock:
Slope 20℃/min
Number of cycles 50cycles(no operation during impact)
The U.S. military's technical standards and test conditions for laptop procurement are as follows:
Impact test: Drop the computer 26 times from all sides, sides and corners at a height of 90 cm
Earthquake resistance test :20Hz~1000Hz, 1000Hz~2000Hz frequency once an hour X, Y and Z axis continuous vibration
Temperature test :0℃~60℃ 72 hours of aging oven
Waterproof test: Spray water on the computer for 10 minutes in all directions, and the water spray rate is 1mm per minute
Dust test: Spray the concentration of 60,000 mg/ per cubic meter of dust for 2 seconds (interval of 10 minutes, 10 consecutive times, time 1 hour)
Meets MIL-STD-810 military specifications
Waterproof test:
Us Army notebook :protection class:IP54(dust & rain) Sprayed the computer with water in all directions for 10 minutes at a rate of 1mm per minute.
Dust proof test:
Us Army notebook: Spray a concentration of 60,000 mg/ m3 of dust for 2 seconds (10 minute intervals, 10 consecutive times, time 1 hour)
Temperature Cyclic Stress Screening (1)
Environmental Stress Screening (ESS)
Stress screening is the use of acceleration techniques and environmental stress under the design strength limit, such as: burn in, temperature cycling, random vibration, power cycle... By accelerating the stress, the potential defects in the product emerge [potential parts material defects, design defects, process defects, process defects], and eliminate electronic or mechanical residual stress, as well as eliminate stray capacitors between multi-layer circuit boards, the early death stage of the product in the bath curve is removed and repaired in advance, so that the product through moderate screening, Save the normal period and decline period of the bathtub curve to avoid the product in the process of use, the test of environmental stress sometimes lead to failure, resulting in unnecessary losses. Although the use of ESS stress screening will increase the cost and time, for improving the product delivery yield and reduce the number of repairs, there is a significant effect, but for the total cost will be reduced. In addition, customer trust will also be improved, generally for electronic parts of the stress screening methods are pre-burning, temperature cycle, high temperature, low temperature, PCB printed circuit board stress screening method is temperature cycle, for the electronic cost of the stress screening is: Power pre-burning, temperature cycling, random vibration, in addition to the stress screen itself is a process stage, rather than a test, screening is 100% of the product procedure.
Stress screening applicable product stage: R & D stage, mass production stage, before delivery (screening test can be carried out in components, devices, connectors and other products or the whole machine system, according to different requirements can have different screening stress)
Stress screening comparison:
a. Constant high temperature pre-burning (Burn in) stress screening, is the current electronic IT industry commonly used method to precipitate electronic components defects, but this method is not suitable for screening parts (PCB, IC, resistor, capacitor), According to statistics, the number of companies in the United States that use temperature cycling to screen parts is five times more than the number of companies that use constant high temperature prefiring to screen components.
B. GJB/DZ34 indicates the proportion of temperature cycle and random vibrating screen selection defects, temperature accounted for about 80%, vibration accounted for about 20% of the defects in various products.
c. The United States has conducted a survey of 42 enterprises, random vibration stress can screen out 15 to 25% of the defects, while the temperature cycle can screen out 75 to 85%, if the combination of the two can reach 90%.
d. The proportion of product defect types detected by temperature cycling: insufficient design margin: 5%, production and workmanship errors: 33%, defective parts: 62%
Description of fault induction of temperature cyclic stress screening:
The cause of product failure induced by temperature cycling is: when the temperature is cycled within the upper and lower extremal temperatures, the product produces alternating expansion and contraction, resulting in thermal stress and strain in the product. If there is a transient thermal ladder (temperature non-uniformity) within the product, or the thermal expansion coefficients of adjacent materials within the product do not match each other, these thermal stresses and strains will be more drastic. This stress and strain is greatest at the defect, and this cycle causes the defect to grow so large that it can eventually cause structural failure and generate electrical failure. For example, a cracked electroplated through-hole eventually cracks completely around it, causing an open circuit. Thermal cycling enables soldering and plating through holes on printed circuit boards... Temperature cyclic stress screening is especially suitable for electronic products with printed circuit board structure.
The fault mode triggered by the temperature cycle or the impact on the product is as follows:
a. The expansion of various microscopic cracks in the coating, material or wire
b. Loosen poorly bonded joints
c. Loosen improperly connected or riveted joints
d. Relax the pressed fittings with insufficient mechanical tension
e. Increase the contact resistance of poor quality solder joints or cause an open circuit
f. Particle, chemical pollution
g. Seal failure
h. Packaging issues, such as bonding of protective coatings
i. Short circuit or open circuit of the transformer and coil
j. The potentiometer is defective
k. Poor connection of welding and welding points
l. Cold welding contact
m. Multi-layer board due to improper handling of open circuit, short circuit
n. Short circuit of power transistor
o. Capacitor, transistor bad
p. Dual row integrated circuit failure
q. A box or cable that is nearly short-circuited due to damage or improper assembly
r. Breakage, breakage, scoring of material due to improper handling... Etc.
s. out-of-tolerance parts and materials
t. resistor ruptured due to lack of synthetic rubber buffer coating
u. The transistor hair is involved in the grounding of the metal strip
v. Mica insulation gasket rupture, resulting in short circuit transistor
w. Improper fixing of the metal plate of the regulating coil leads to irregular output
x. The bipolar vacuum tube is open internally at low temperature
y. Coil indirect short circuit
z. Ungrounded terminals
a1. Component parameter drift
a2. Components are improperly installed
a3. Misused components
a4. Seal failure
Introduction of stress parameters for temperature cyclic stress screening:
The stress parameters of temperature cyclic stress screening mainly include the following: high and low temperature extremum range, dwell time, temperature variability, cycle number
High and low temperature extremal range: the larger the range of high and low temperature extremal, the fewer cycles required, the lower the cost, but can not exceed the product can withstand the limit, do not cause new fault principle, the difference between the upper and lower limits of temperature change is not less than 88°C, the typical range of change is -54°C to 55°C.
Dwell time: In addition, the dwell time can not be too short, otherwise it is too late to make the product under test produce thermal expansion and contraction stress changes, as for the dwell time, the dwell time of different products is different, you can refer to the relevant specification requirements.
Number of cycles: As for the number of cycles of temperature cyclic stress screening, it is also determined by considering product characteristics, complexity, upper and lower limits of temperature and screening rate, and the screening number should not be exceeded, otherwise it will cause unnecessary harm to the product and cannot improve the screening rate. The number of temperature cycles ranges from 1 to 10 cycles [ordinary screening, primary screening] to 20 to 60 cycles [precision screening, secondary screening], for the removal of the most likely workmanship defects, about 6 to 10 cycles can be effectively removed, in addition to the effectiveness of the temperature cycle, Mainly depends on the temperature variation of the product surface, rather than the temperature variation inside the test box.
There are seven main influencing parameters of temperature cycle:
(1) Temperature Range
(2) Number of Cycles
(3) Temperature Rate of Chang
(4) Dwell Time
(5) Airflow Velocities
(6) Uniformity of Stress
(7) Function test or not (Product Operating Condition)
Temperature Cyclic Stress Screening (2)
Introduction of stress parameters for temperature cyclic stress screening:
The stress parameters of temperature cyclic stress screening mainly include the following: high and low temperature extremum range, dwell time, temperature variability, cycle number
High and low temperature extremal range: the larger the range of high and low temperature extremal, the fewer cycles required, the lower the cost, but can not exceed the product can withstand the limit, do not cause new fault principle, the difference between the upper and lower limits of temperature change is not less than 88°C, the typical range of change is -54°C to 55°C.
Dwell time: In addition, the dwell time can not be too short, otherwise it is too late to make the product under test produce thermal expansion and contraction stress changes, as for the dwell time, the dwell time of different products is different, you can refer to the relevant specification requirements.
Number of cycles: As for the number of cycles of temperature cyclic stress screening, it is also determined by considering product characteristics, complexity, upper and lower limits of temperature and screening rate, and the screening number should not be exceeded, otherwise it will cause unnecessary harm to the product and cannot improve the screening rate. The number of temperature cycles ranges from 1 to 10 cycles [ordinary screening, primary screening] to 20 to 60 cycles [precision screening, secondary screening], for the removal of the most likely workmanship defects, about 6 to 10 cycles can be effectively removed, in addition to the effectiveness of the temperature cycle, Mainly depends on the temperature variation of the product surface, rather than the temperature variation inside the test box.
There are seven main influencing parameters of temperature cycle:
(1) Temperature Range
(2) Number of Cycles
(3) Temperature Rate of Chang
(4) Dwell Time
(5) Airflow Velocities
(6) Uniformity of Stress
(7) Function test or not (Product Operating Condition)
Stress screening fatigue classification:
The general classification of Fatigue research can be divided into High-cycle Fatigue, Low-cycle Fatigue and Fatigue Crack Growth. In the aspect of low cycle Fatigue, it can be subdivided into Thermal Fatigue and Isothermal Fatigue.
Stress screening acronyms:
ESS: Environmental stress screening
FBT: Function board tester
ICA: Circuit analyzer
ICT: Circuit tester
LBS: load board short-circuit tester
MTBF: mean time between failures
Time of temperature cycles:
a.MIL-STD-2164(GJB 1302-90) : In the defect removal test, the number of temperature cycles is 10, 12 times, and in the trouble-free detection it is 10 ~ 20 times or 12 ~ 24 times. In order to remove the most likely workmanship defects, about 6 ~ 10 cycles are needed to effectively remove them. 1 ~ 10 cycles [general screening, primary screening], 20 ~ 60 cycles [precision screening, secondary screening].
B.od-hdbk-344 (GJB/DZ34) Initial screening equipment and unit level uses 10 to 20 loops (usually ≧10), component level uses 20 to 40 loops (usually ≧25).
Temperature variability:
a.MIL-STD-2164(GJB1032) clearly states: [Temperature change rate of temperature cycle 5℃/min]
B.od-hdbk-344 (GJB/DZ34) Component level 15 ° C /min, system 5 ° C /min
c. Temperature cyclic stress screening is generally not specified temperature variability, and its commonly used degree variation rate is usually 5°C/min
Test de rupture transitoire du cycle de température de la plaque VMRLe test de cycle de température est l'une des méthodes les plus couramment utilisées pour tester la fiabilité et la durée de vie des matériaux de soudage sans plomb et des pièces CMS. Il évalue les pièces adhésives et les joints de soudure sur la surface des CMS et provoque une déformation plastique et une fatigue mécanique des matériaux des joints de soudure sous l'effet de fatigue du cycle de température froide et chaude avec une variabilité de température contrôlée, afin de comprendre les dangers potentiels et les facteurs de défaillance. de joints de soudure et CMS. Le diagramme en guirlande est connecté entre les pièces et les joints de soudure. Le processus de test détecte les coupures et les coupures entre les lignes, les pièces et les joints de soudure grâce au système de mesure de rupture instantanée à grande vitesse, qui répond à la demande de test de fiabilité des connexions électriques pour évaluer si les joints de soudure, les billes d'étain et les pièces tombent en panne. Ce test n'est pas vraiment simulé. Son objectif est d'appliquer des contraintes sévères et d'accélérer le facteur de vieillissement sur l'objet à tester pour confirmer si le produit est conçu ou fabriqué correctement, puis d'évaluer la durée de vie en fatigue thermique des joints de soudure des composants. Le test de fiabilité de la connexion électrique à coupure instantanée à grande vitesse est devenu un maillon clé pour assurer le fonctionnement normal du système électronique et éviter la défaillance de la connexion électrique causée par la défaillance du système immature. Les changements de résistance sur une courte période de temps ont été observés lors de changements accélérés de température et d’essais de vibration.But:1. S'assurer que les produits conçus, fabriqués et assemblés répondent aux exigences prédéterminées2. Relaxation de la contrainte de fluage des joints de soudure et de la rupture de rupture CMS causée par la différence de dilatation thermique3. La température maximale de test du cycle de température doit être inférieure de 25 ℃ à la température Tg du matériau PCB, afin d'éviter plus d'un mécanisme d'endommagement du produit de test de remplacement.4. La variabilité de la température à 20 ℃/min est un cycle de température, et la variabilité de la température au-dessus de 20 ℃/min est un choc thermique.5. L'intervalle de mesure dynamique du joint de soudage ne dépasse pas 1 min6. Le temps de séjour à haute et basse température pour la détermination des défaillances doit être mesuré en 5 coups.Exigences:1. Le temps de température total du produit testé se situe dans la plage de la température maximale nominale et de la température minimale, et la durée du temps de séjour est très importante pour le test accéléré, car le temps de séjour n'est pas suffisant pendant le test accéléré. , ce qui rendra le processus de fluage incomplet2. La température du résident doit être supérieure à la température Tmax et inférieure à la température Tmin.Se référer à la liste des spécifications :IPC-9701, IPC650-2.6.26, IPC-SM-785, IPCD-279, J-STD-001, J-STD-002, J-STD-003, JESD22-A104, JESD22-B111, JESD22-B113, JESD22-B117 , SJR-01
Modules solaires CA et micro-onduleurs 1La puissance de sortie globale du panneau de cellules solaires est considérablement réduite, principalement en raison de certains dommages au module (grêle, pression du vent, vibration du vent, pression de la neige, coup de foudre), des ombres locales, de la saleté, de l'angle d'inclinaison, de l'orientation, des différents degrés de vieillissement, petites fissures... Ces problèmes entraîneront un désalignement de la configuration du système, entraînant une réduction des défauts d'efficacité de sortie, difficiles à surmonter avec les onduleurs centralisés traditionnels. Ratio des coûts de production d'énergie solaire : module (40 ~ 50 %), construction (20 ~ 30 %), onduleur (
Modules solaires à courant alternatif et micro-onduleurs 2Spécification de test du module AC :Certification ETL : UL 1741, norme CSA 22.2, norme CSA 22.2 n° 107.1-1, IEEE 1547, IEEE 929Module photovoltaïque : UL1703Bulletin : 47CFR, partie 15, classe BIndice de surtension : IEEE 62.41 classe BCode national de l'électricité : NEC 1999-2008Dispositifs de protection contre les arcs : IEEE 1547Ondes électromagnétiques : BS EN 55022, FCC Classe B selon CISPR 22B, EMC 89/336/EEG, EN 50081-1, EN 61000-3-2, EN 50082-2, EN 60950Micro-onduleur (Micro-onduleur) : UL1741-calss ATaux de défaillance typique des composants : MIL HB-217FAutres spécifications :CEI 503, CEI 62380 IEEE1547, IEEE929, IEEE-P929, IEEE SCC21, ANSI/NFPA-70 NEC690.2, NEC690.5, NEC690.6, NEC690.10, NEC690.11, NEC690.14, NEC690.17, NEC690 .18, NEC690.64Principales spécifications du module solaire AC :Température de fonctionnement : -20 ℃ ~ 46 ℃, -40 ℃ ~ 60 ℃, -40 ℃ ~ 65 ℃, -40 ℃ ~ 85 ℃, -20 ~ 90 ℃Tension de sortie : 120/240 V, 117 V, 120/208 VFréquence de puissance de sortie : 60 HzAvantages des modules AC :1. Essayez d'augmenter la production d'énergie de chaque module de puissance de l'onduleur et suivez la puissance maximale, car le point de puissance maximale d'un seul composant est suivi, la production d'énergie du système photovoltaïque peut être considérablement améliorée, qui peut être augmentée de 25 % .2. En ajustant la tension et le courant de chaque rangée de panneaux solaires jusqu'à ce que tous soient équilibrés, afin d'éviter toute inadéquation du système.3. Chaque module dispose d'une fonction de surveillance pour réduire les coûts de maintenance du système et rendre le fonctionnement plus stable et fiable.4. La configuration est flexible et la taille des cellules solaires peut être installée sur le marché domestique en fonction des ressources financières de l'utilisateur.5. Pas de haute tension, plus sûr à utiliser, facile à installer, plus rapide, faible coût de maintenance et d'installation, réduit la dépendance vis-à-vis des fournisseurs de services d'installation, de sorte que le système d'énergie solaire puisse être installé par les utilisateurs eux-mêmes.6. Le coût est similaire voire inférieur à celui des onduleurs centralisés.7. Installation facile (temps d’installation réduit de moitié).8. Réduisez les coûts d’approvisionnement et d’installation.9. Réduire le coût global de la production d’énergie solaire.10. Aucun programme spécial de câblage et d’installation.11. La panne d'un seul module AC n'affecte pas les autres modules ou systèmes.12. Si le module est anormal, l'interrupteur d'alimentation peut être automatiquement coupé.13. Seule une simple procédure d'interruption est requise pour la maintenance.14. Peut être installé dans n'importe quelle direction et n'affectera pas les autres modules du système.15. Il peut remplir tout l’espace de réglage, à condition qu’il soit placé en dessous.16. Réduisez le pont entre la ligne CC et le câble.17. Réduisez les connecteurs DC (connecteurs DC).18. Réduisez la détection des défauts à la terre CC et réglez les dispositifs de protection.19. Réduisez les boîtes de jonction CC.20. Réduisez la diode de dérivation du module solaire.21. Il n’est pas nécessaire d’acheter, d’installer et d’entretenir de gros onduleurs.22. Pas besoin d’acheter des piles.23. Chaque module est installé avec un dispositif anti-arc qui répond aux exigences de la spécification UL1741.24. Le module communique directement via le fil de sortie d'alimentation CA sans configurer une autre ligne de communication.25. 40 % de composants en moins.
Modules solaires à courant alternatif et micro-onduleurs 3Méthode de test du module AC :1. Test de performance de sortie : équipement de test de module existant, pour les tests liés au module non onduleur2. Test de contrainte électrique : effectuez un test de cycle de température dans différentes conditions pour évaluer les caractéristiques de l'onduleur dans des conditions de température de fonctionnement et de température de veille.3. Test de contrainte mécanique : découvrez le micro-onduleur à faible adhérence et le condensateur soudé sur la carte PCB4. Utilisez un simulateur solaire pour les tests globaux : un simulateur solaire à impulsions en régime permanent de grande taille et avec une bonne uniformité est requis5. Test extérieur : enregistrement de la courbe IV de sortie du module et de la courbe de conversion de l'efficacité de l'onduleur dans un environnement extérieur6. Test individuel : chaque composant du module est testé séparément dans la salle et le bénéfice global est calculé par la formule7. Test d'interférence électromagnétique : étant donné que le module comporte un composant onduleur, il est nécessaire d'évaluer l'impact sur EMC&EMI lorsque le module fonctionne sous le simulateur de lumière solaire.Causes courantes de défaillance des modules AC :1. La valeur de la résistance est incorrecte2. La diode est inversée3. Causes de défaillance de l'onduleur : défaillance du condensateur électrolytique, humidité, poussièreConditions de test du module AC :Test HAST : 110℃/85 %R.H./206h (Laboratoire National Sandia)Test haute température (UL1741) : 50℃, 60℃Cycle de température : -40℃←→90℃/200cycleCongélation humide : 85℃/85 %R.H.←→-40℃/10cycles, 110 cycles (test Enphase-ALT)Test de chaleur humide : 85℃/85 %R.H/1000hTests de pression environnementale multiples (MEOST) : -50 ℃ ~ 120 ℃, vibration 30G ~ 50GÉtanchéité : NEMA 6/24 heuresTest foudre : Surtension tolérée jusqu'à 6 000 VAutres (voir UL1703) : test de pulvérisation d'eau, test de résistance à la traction, test anti-arcMTBF des modules liés à l'énergie solaire :Onduleur traditionnel 10 ~ 15 ans, micro-onduleur 331 ans, module PV 600 ans, micro-onduleur 600 ans [futur]Introduction du micro-onduleur :Instructions : micro-onduleur (micro-onduleur) appliqué au module solaire, chaque module solaire CC est équipé d'un, peut réduire la probabilité d'apparition d'un arc, le micro-onduleur peut directement via le fil de sortie d'alimentation CA, communication réseau directe, il suffit d'installer une alimentation. Pont Ethernet de ligne (Powerline Ethernet Bridge) sur la prise, pas besoin de configurer une autre ligne de communication, les utilisateurs peuvent via la page Web de l'ordinateur, iPhone, blackberry, tablette... Etc., regarder directement l'état de fonctionnement de chaque module (puissance de sortie, température du module, message de défaut, code d'identification du module), s'il y a une anomalie, elle peut être réparée ou remplacée immédiatement, afin que l'ensemble du système d'énergie solaire puisse fonctionner sans problème, car le micro-onduleur est installé derrière le module, ainsi l'effet de vieillissement des ultraviolets sur le micro-onduleur est également faible.Spécifications du micro-onduleur :UL 1741 CSA 22.2, CSA 22.2, n° 107.1-1 IEEE 1547 IEEE 929 FCC 47CFR, partie 15, classe B Conforme au National Electric Code (NEC 1999-2008) EIA-IS-749 (test de durée de vie des applications majeures corrigé, spécification pour utilisation de condensateur)Test du micro-onduleur :1. Test de fiabilité du micro-onduleur : poids du micro-onduleur + 65 livres * 4 fois2. Test d'étanchéité du micro-onduleur : NEMA 6 [fonctionnement continu de 1 mètre dans l'eau pendant 24 heures]3. Congélation humide selon la méthode de test IEC61215 : 85℃/85%R.H.←→-45℃/110 jours4. Test de durée de vie accéléré du micro-onduleur [110 jours au total, test dynamique à la puissance nominale, garantit que le micro-onduleur peut durer plus de 20 ans] :Étape 1 : Congélation humide : 85℃/85%R.H.←→-45℃/10 joursÉtape 2 : Cycle de température : -45℃←→85℃/50 joursÉtape 3 : Chaleur humide : 85℃/85 %R.H./50 jours
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