Is the Future of Semiconductors Bright?
Thanks to the rise of the concept of "5G+ Internet of everything" and the rapid development of new energy vehicles, the demand for chips has increased comprehensively. And because of the impact of the epidemic and Sino-US trade friction, the supply of chips has been affected, so the domestic market will flourish under these factors.
The following is a conceptual diagram of the semiconductor industry chain:
It can be intuitively seen that the semiconductor industry is a very large industrial chain, and the terminal of the final use is inseparable from our lives. They are essentially chips made of silicon wafers.
The following is the flow chart of the chip production:
As can be seen in the figure above, the aging test of the chip is an essential part, and the aging test of the chip needs to use a professional industrial oven for aging test and high temperature baking.
The aging test not only led to the development of industrial ovens, but also led to the development of wafer boxes, automatic plying machines, tape braiding machines and other equipment. This process alone has such a large industry, which shows that the future of semiconductors is still relatively optimistic.
High Temperature Aging Cabinet
High temperature aging cabinet is a type of aging equipment used to remove early failure of non-conforming product parts.
Use of temperature aging cabinet, aging oven:
This test equipment is a test equipment for aviation, automobile, home appliances, scientific research and other fields, which is used to test and determine the parameters and performance of electrical, electronic and other products and materials after temperature environment changes in high temperature, low temperature, alternating between temperature and humidity or constant temperature and humidity.
The chamber of the test equipment is sprayed with steel plate after treatment, and the spray color is optional, generally beige. SUS304 mirror stainless steel is used in the inner room, with a large window tempered glass, real-time observation of internal aging products.
Features of temperature aging cabinet, aging oven:
1. PLC processing industry touch screen programming combination control, balanced temperature control system: aging specimen room temperature rise start the ventilation fan, balance the sample heat, aging cabinet is divided into product area and load area
2. PID+SSR temperature control system: according to the temperature change in the specimen box, the heat of the heating tube is automatically adjusted to achieve the temperature balance, so that the heating heat of the system is equal to its heat loss and achieve the temperature balance control, so it can run stably for a long time; The fluctuation of temperature control is less than ±0.5℃
3. The air transport system is composed of three-phase asynchronous electronic multi-wing wind wheel and wind drum. The wind pressure is large, the wind speed is uniform, and the uniformity of each temperature point is met
4. High precision PT100 platinum resistance for temperature acquisition, high accuracy for temperature acquisition
5. Load control, the load control system provides ON/OFF control and timing control two functional options to meet the different test requirements of the product
(1)ON/OFF function introduction: The switch time, stop time, and cycle times can be set, the test product can be switched according to the setting requirements of the system, the stop cycle control, the aging cycle number reaches the set value, the system will automatically sound and light prompt
(2) Timing control function: the system can set the running time of the test product. When the load starts, the product power supply starts timing. When the actual timing time reaches the time set by the system, the power supply to the product is stopped
6. System operation safety and stability: The use of PLC industrial touch screen control system, stable operation, strong anti-interference, convenient program change, simple line. Perfect alarm protection device (see protection mode), real-time monitoring of the operating status of the system, with the function of automatic maintenance of temperature data during operation, in order to query the temperature historical data when the product is aging, the data can be copied to the computer through the USB interface for analysis (format is EXCEL), with historical data curve display function, It intuitively reflects the temperature change in the product area during the product test, and its curve can be copied to the computer in BMP format through the USB interface, so as to facilitate the operator to make the test product report. The system has the function of fault query, the system will automatically record the alarm situation, when the equipment fails, the software will automatically pop up the alarm screen to remind the cause of the fault and its solution; Stop the power supply to the test product to ensure the safety of the test product and the equipment itself, and record the fault situation and occurrence time for future maintenance.
Thermal Cycling Test(TC) & Thermal Shock Test(TS)
Thermal Cycling Test(TC):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
A series of high and low temperature cycling tests are done on the temperature change at the temperature variation rate of 5~15 degrees per minute, which is not a real simulation of the actual situation. Its purpose is to apply stress to the test piece, accelerate the aging factor of the test piece, so that the test piece may cause damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The lubricant deteriorates and loses lubrication
Loss of mechanical strength, resulting in cracks and cracks
The deterioration of the material causes chemical action
Scope of application:
Module/system product environment simulation test
Module/System Product Strife test
PCB/PCBA/ Solder Joint Accelerated Stress Test (ALT/AST)...
Thermal Shock Test(TS):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
High and low temperature shock tests under extremely harsh conditions on rapid temperature changes at a temperature variability of 40 degrees per minute are not truly simulated. Its purpose is to apply severe stress to the test piece to accelerate the aging factor of the test piece, so that the test piece may cause potential damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The product structure is damaged or the strength is reduced
Tin cracking of components
The deterioration of the material causes chemical action
Seal damage
Machine specifications:
Temperature range: -60 ° C to +150 ° C
Recovery time: < 5 minutes
Inside dimension: 370*350*330mm (D×W×H)
Scope of application:
PCB reliability acceleration test
Accelerated life test of vehicle electric module
LED parts accelerated test...
Effects of temperature changes on products:
The coating layer of components falls off, the potting materials and sealing compounds crack, even the sealing shell cracks, and the filling materials leak, which causes the electrical performance of components to decline.
Products composed of different materials, when the temperature changes, the product is not evenly heated, resulting in product deformation, sealing products cracking, glass or glassware and optics broken;
The large temperature difference makes the surface of the product condense or frost at low temperature, evaporates or melts at high temperature, and the result of such repeated action leads to and accelerates the corrosion of the product.
Environmental effects of temperature change:
Broken glass and optical equipment.
The movable part is stuck or loose.
Structure creates separation.
Electrical changes.
Electrical or mechanical failure due to rapid condensation or freezing.
Fracture in a granular or striated manner.
Different shrinkage or expansion characteristics of different materials.
The component is deformed or broken.
Cracks in surface coatings.
Air leak in the containment compartment.
Semiconductor Chip-Car Gauge Chip
A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.
MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.
The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.
It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.
Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.
Vibrational Verification for Functionality(VVF)
In the vibration generated during transportation, freight boxes are susceptible to complex dynamic pressures, and the resonant response generated is violent, which may cause packaging or product failure. Identifying the critical frequency and the type of pressure on the package will minimize this failure. Vibration testing is the assessment of the vibration resistance of components, components and complete machines in the expected transport, installation and use environment.
Common vibration modes can be divided into sinusoidal vibration and random vibration. Sinusoidal vibration is a test method often used in the laboratory, which mainly simulates the vibration generated by rotation, pulsation and oscillation, as well as the resonance frequency analysis and resonance point residence verification of the product structure. It is divided into sweep frequency vibration and fixed frequency vibration, and its severity depends on the frequency range, amplitude value and test duration. Random vibration is used to simulate the overall structural seismic strength assessment of the product and the shipping environment in the packaged state, with the severity depending on the frequency range, GRMS, test duration and axial orientation.
Vibration can not only loosen the lamp components, so that the internal relative displacement, resulting in de-welding, poor contact, poor working performance, but also make the components produce noise, wear, physical failure and even component fatigue.
To this end, Lab Companion launched a professional "LED lamp vibration test" business to simulate the vibration or mechanical shock that may occur in the actual transportation, installation and use environment of the lamp, evaluate the vibration resistance of the LED lamp and the stability of its related performance indicators, and find the weak link that may cause damage or failure. Improve the overall reliability of LED products and improve the failure status of the industry due to transportation or other mechanical shocks.
Service customers: LED lighting factory, lighting agents, lighting dealers, decoration companies
Test method:
1, the LED lamp sample packaging placed on the vibration test bench;
2, the vibration speed of the vibration tester is set to 300 RPM, the amplitude is set to 2.54 cm, start the vibration meter;
3, the lamp according to the above method in the upper and lower, left and right, front and back three directions respectively test for 30 minutes.
Results evaluation: After the vibration test, the lamp can not occur parts falling off, structural damage, lighting and other abnormal phenomena.
Double 85 Constant Temperature And Humidity Reliability Environmental Test (THB)
First, high temperature and humidity test
WHTOL (Wet High Temperature Operating Life) is a common environmental stress acceleration test, usually 85℃ and 85% relative humidity, which is generally carried out in accordance with the standard IEC 60068-2-67-2019. The test conditions are shown in the chart.
Second, the test principle
"Double 85 test" is one of the reliability environmental tests, mainly used for constant temperature and humidity box, that is, the temperature of the box is set to 85℃, the relative humidity is set to 85%RH conditions, to accelerate the aging of the test product. Although the test process is simple, the test is an important method to evaluate many characteristics of the test product, so it has become an indispensable reliability environmental test condition in various industries.
After aging the product under the condition of 85℃/85%RH, compare the performance changes of the product before and after aging, such as the photoelectric performance parameters of the lamp, the mechanical properties of the material, yellow index, etc., the smaller the difference, the better, so as to test the heat and moisture resistance of the product.
The product may have thermal failure when working in a continuous high temperature environment, and some moisture sensitive devices will fail in a high humidity environment. The dual 85 test can test the thermal stress generated by the product under high humidity and its ability to resist long-term moisture penetration. For example, the frequent failure of various products in the humid weather period in the south is mainly due to the poor temperature and humidity resistance of the products.
3. Experimental factors
In the LED lighting industry, many manufacturers have used the double 85 test results as an important means to judge the quality of lamps. Various possible reasons why LED lamps fail the dual 85 test are:
1. Lamp power supply: poor heat resistance of shell, danger of short circuit in circuit, failure of protection mechanism, etc.
2. Lamp structure: unreasonable design of heat dissipation body, installation problems, materials are not resistant to high temperature.
3. Lamp light source: poor moisture resistance, packaging adhesive aging, high temperature resistance.
If you encounter a special use environment, such as the working environment temperature is severe, you need to test its high and low temperature resistance, the test method can refer to the high and low temperature test project.
4. Serve customers
01. Customer group
LED lighting factory, LED power plant, LED packaging factory
02. Means of detection
Constant temperature and humidity test chamber
03. Reference standards
Constant temperature and humidity tests for electrical and electronic products -- Environmental testing -- Part 2: Test methods -- Test Cab: Constant temperature and humidity test GB/T 2423.3-2006.
04. Service content
4.1 Refer to the standard, conduct double 85 test on the product, and provide the third party's test results report.
4.2 Provide the analysis and improvement plan of the product through the double 85 test.
Reliability Test
AEC-Q102 Test Certification Fixed Damp Heat with Humidity Cycling (FMG), LED lamp reliability test method (GB/T 33721-2017), Component screening Ammonia test CAF test, Flame retardant grade Cyclic corrosion test (CCT), Mechanical shock test, High pressure cooker test (PCT), Highly Accelerated Stress Testing (HAST), High and low temperature and humidity test (THB), Hydrogen sulfide test (H2S), Liquid tank thermal shock test (TMSK), Component humidity sensitive grade test (MSL), Screening for high reliability use Hot flash test + acoustic sweep screening for high reliability use (MSL+SAT), LED luminaires reliability test scheme, Vibration test (VVF), Temperature cycle/thermal shock test (TC/TS), LED red Ink test UV aging test, LED light source anti-vulcanization test, Double 85 constant temperature and humidity reliability environmental test (THB), Salt spray test check.
Burn-in Oven
Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its useable life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.
Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.
Figure 1. Photo of Bare and Socket-populated Burn-in Boards
The operating life cycle distribution of a population of devices may be modeled as a bath tub curve, if the failures are plotted on the y-axis against the operating life in the x-axis. The bath tub curve shows that the highest failure rates experienced by a population of devices occur during the early stage of the life cycle, or early life, and during the wear-out period of the life cycle. Between the early life and wear-out stages is a long period wherein the devices fail very sparingly.
Figure 2. Burn-in ovens
Early life failure (ELF) monitor burn-in, as the name implies, is performed to screen out potential early life failures. It is conducted for a duration of 168 hours or less, and normally for only 48 hours. Electrical failures after ELF monitor burn-in are known as early life failures or infant mortality, which means that these units will fail prematurely if they were used in their normal operation.
High Temperature Operating Life (HTOL) Test is the opposite of ELF monitor burn-in, testing the reliability of the samples in their wear-out phase. HTOL is conducted for a duration of 1000 hours, with intermediate read points at 168 H and 500 H.
Although the electrical excitation applied to the samples are often defined in terms of voltages, failure mechanisms accelerated by current (such as electromigration) and electric fields (such as dielectric rupture) are understandably accelerated by burn-in as well.
High Temperature Furnace Inspection Index
What is the high temperature furnace test standard? What metrics are tested? How long is the detection cycle? Which items are tested?
Test items (reference) :
Temperature uniformity test, system accuracy test, temperature, system accuracy, temperature uniformity, high temperature furnace verification and calibration, high temperature furnace (tube furnace) verification and calibration, box resistance furnace (high temperature furnace, heat treatment furnace) verification and calibration, high temperature furnace (box resistance furnace, dry furnace, heat treatment furnace) verification and calibration, silica
List of testing standards:
1, NCS/ CJ M61; SAE AMS 2750; JJF1376 High temperature furnace calibration specification NCS/ CJ M61, high temperature furnace calibration method SAE AMS 2750E, box type resistance furnace calibration specification JJF1376
2, AMS 2750F High temperature measurement AMS 2750F
3, GB 25576-2010 Food safety national standard Food additive silica (high temperature furnace method)
4, JJF 1184 thermocouple verification furnace temperature field test technical specification
5, AMS 2750E high temperature measurement AMS 2750E
6, AMS 2750F high temperature determination method 3.5
7, AMS 2750G high temperature measurement AMS 2750G
8, AMS 2750E high temperature determination method 1
9. JJF 1376; AMS 2750; JJG 276 Calibration specification for box type resistance furnace JJF 1376, high temperature measurement method AMS 2750E, high temperature creep, durable strength testing machine verification regulation JJG 276
10, JJF 1376 box type resistance furnace calibration specification
11, GB/T 9452-2012 heat treatment furnace effective heating zone determination method 1
12. SAE AMS 2750 high-temperature calibration method F
Chambre d'essai de cyclage rapide de la température Lab CompanionPrésentation de Lab CompanionAvec plus de 20 ans d'expérience, Compagnon de laboratoire est un fabricant de classe mondiale d'enceintes environnementales et un fournisseur accompli de systèmes et d'équipements de test clé en main. Toutes nos chambres s'appuient sur la réputation de Lab Companion en matière de longue durée de vie et de fiabilité exceptionnelle. Avec une portée de conception, de fabrication et de service, Lab Companion a établi un système de gestion de la qualité conforme à la norme internationale du système de qualité ISO 9001:2008. Le programme d'étalonnage des équipements de Lab Companion est accrédité selon la norme internationale ISO 17025 et la norme nationale américaine ANSI/NCSL-Z-540-1 par A2LA. A2LA est membre à part entière et signataire de la Coopération internationale pour l'accréditation des laboratoires (ILAC), de l'Asia Pacific Laboratory Accreditation (APLAC) et de la Coopération européenne pour l'accréditation (EA). Les chambres d'essais environnementaux de la série SE de Lab Companion offrent un système de circulation d'air considérablement amélioré, qui offre de meilleurs gradients et des taux de changement de température des produits améliorés. Ces chambres utilisent le programmeur/contrôleur phare 8800 de Thermotron, doté d'un écran plat haute résolution de 12,1 pouces avec interface utilisateur à écran tactile, de capacités étendues de création de graphiques, d'enregistrement de données, de modification, d'accès à l'aide à l'écran et de stockage de données sur disque dur à long terme.Non seulement nous proposons des produits de la plus haute qualité, mais nous fournissons également une assistance continue conçue pour vous permettre de rester opérationnel longtemps après la vente initiale. Nous fournissons un service local direct en usine avec un vaste inventaire des pièces dont vous pourriez avoir besoin. PerformancePlage de température : -70°C à +180°CPerformance : Avec une charge d'aluminium de 23 kg (IEC60068-3-5), le taux de montée de +85°C à -40°C est de 15℃/min ; la vitesse de refroidissement de -40°C à +85°C est également de 15℃/min.Contrôle de la température : ± 1°C Températures sèches à partir du point de contrôle après stabilisation au niveau du capteur de contrôleLes performances sont basées sur des conditions ambiantes de 75 °F (23,9 °C) et 50 % d'humidité relative.Performances de refroidissement/chauffage basées sur la mesure au niveau du capteur de contrôle dans le flux d'air souffléConstruireIntérieurAcier inoxydable non magnétique série 300 à haute teneur en nickelCoutures internes soudées à l'héliarc pour une fermeture hermétique du linerCoins et coutures conçus pour permettre l'expansion et la contraction sous les températures extrêmes rencontréesÉvacuation des condensats située dans le plancher liner et sous le plénum de climatisationLa base de la chambre est entièrement soudéeIsolant en fibre de verre « Ultra-Lite » non décantantUne tablette intérieure réglable en acier inoxydable est standardExtérieurTôle d'acier traitée matricéeCouvercles d'accès en métal fournis pour une ouverture facile des portes vers les composants électriquesVernis de finition à base d'eau, séché à l'air, pulvérisé sur une surface nettoyée et apprêtée.Portes d'accès à charnières faciles à soulever pour l'entretien du système de réfrigérationUn port d'accès de 12,5 cm de diamètre avec soudure intérieure et bouchon isolant amovible monté dans la paroi latérale droite, accessoires sur porte battante pour un accès facileCaractéristiquesLe fonctionnement de la chambre affiche clairement des informations utiles sur le temps d'exécutionL'écran graphique offre des capacités étendues, une programmation et des rapports améliorésL'état du système affiche les paramètres cruciaux du système de réfrigérationProgram Entry facilite le chargement, l'affichage et la modification des profilsLes assistants de configuration rapides facilitent la saisie du profilTableaux de réfrigération contextuels pour référence pratiqueTherm-Alarm® offre une protection par alarme de surchauffe et de sous-températureL'écran du journal d'activité fournit un historique complet de l'équipementLe serveur Web permet l'accès Internet aux équipements via EthernetLe clavier contextuel convivial rend la saisie des données rapide et facileComprend :- Quatre ports USB : deux externes et deux internes-Ethernet-RS-232Spécifications techniques1 à 4 canaux programmables indépendammentPrécision de mesure : 0,25 % de l'étendue typiqueÉchelle de température sélectionnable en °C ou °FÉcran tactile plat couleur de 12,1 pouces (30 cm)Résolution : 0,1°C, 0,1%RH, 0,01 pour d'autres applications linéairesHorloge en temps réel incluseTaux d'échantillonnage : variable de processus échantillonnée toutes les 0,1 secondeBande proportionnelle : programmable de 1,0 ° à 300 °Méthode de contrôle : numériqueIntervalles : illimitésRésolution d'intervalle : 1 seconde à 99 heures, 59 minutes avec une résolution de 1 seconde-RS-232- 10+ ans de stockage de données- Contrôle de la température du produit- Tableau de relais d'événementsModes de fonctionnement : automatique ou manuelStockage du programme : illimitéBoucles de programme :- Jusqu'à 64 boucles par programmeLes boucles peuvent être répétées jusqu'à 9 999 fois par programme- Jusqu'à 64 boucles imbriquées sont autorisées par
La relation entre l'altitude de l'atmosphère standard et la température et la pression de l'airL'atmosphère standard mentionnée ici fait référence à « l'atmosphère standard de l'OACI de 1964 » adoptée par l'Organisation de l'aviation civile internationale. En dessous d'une altitude de 32 km, c'est la même chose que "1976, atmosphère standard américaine". Les changements de température de l'air près de la surface (en dessous de 32 km) sont :Sol : La température de l'air est de 15,0℃, la pression de l'air P=1013,25mb= 0,101325MPaTaux de changement de température du sol à l'altitude 11 km : -6,5 ℃/kmSur l'interface 11km :La température de l'air est de -56,5 ℃ et la pression de l'air P = 226,32 Mo.Taux de changement de température à des altitudes de 11 à 20 km : 0,0 ℃/kmTaux de changement de température à une altitude de 20 à 32 km : +1,0/kmLe tableau suivant répertorie les valeurs de température et de pression de l'atmosphère standard à différentes altitudes. Dans le tableau, "gpm" est l'altimètre, et son signe négatif représente l'altitudeGpmTempérature℃Pression atmosphérique (mb)GpmTempérature℃Pression atmosphérique (mb)GpmTempérature℃Pression atmosphérique (mb)-40017.61062.24800-16.2554,810000-50,0264,4-20016.31037,55000-17,5540.210200-51,3256.4015,01013.35200-18,8525.910400-52,6248,620013.7989,55400-20.1511.910600-53,9241,040012.4966.15600-21,4498,310800-55,2233,660011.1943.25800-22,7484,911000-56,5226.38009.8920,86000-24,0471,811500-56,5209.210008.5898,76200-25,3459,012000-56,5193.312007.2877.26400-26,6446,512500-56,5178,714005.9856,06600-27,9434.313000-56,5165.116004.6835.26800-29,2422.313500-56,5152,618003.3814.97000-30,5410.614000-56,5141,020002.0795,07200-31,8399,214500-56,5130,322000,7775.47400-33,1388,015000-56,5120,52400-0,6756.37600-34,4377.115500-56,5111.32600-1,9737,57800-35,7366.416000-56,5102,92800-3.2719.18000-37,0356,017000-56,587,93000-4,5701.18200-38,3345,818000-56,575,03200-5,8683.48400-39,6335,919000-56,564.13400-7.1666.28600-40,9326.220000-56,554,73600-8.4649.28800-42,2316.722000-54,540,03800-9,7632,69000-43,5307.424000-52,529.34000-11.0616.49200-44,8298,426000-50,521,54200-12.3600,59400-46,1289,628000-48,515.94400-13,6584,99600-47,4281,030000-46,511.74600-14,9569,79800-48,7272,632000-44,58.7Relation de conversion d'unité1mbar=100Pa=0,1KPa=0,0001 MPa1 pied = 0,3048 m = 304,8 mm55 000 pieds * 0,3048 = 16 764 mLab Companion s'est concentré sur la production d'équipements de test environnemental de fiabilité pendant 19 ans et a aidé avec succès 18 000 entreprises à tester la fiabilité et la performance environnementale des produits et des matériaux.Les principaux produits sont : chambre d'essai à haute température, chambre d'essai de température et d'humidité élevées et basses, chambre d'essai environnemental sans rendez-vous, chambre d'essai de cyclage rapide de la température, chambre d'essai de choc thermique, chambre d'essai basse pression haute et basse température, vibration de la chambre complète et d'autres solutions de fabrication d'équipements de test pour aider les entreprises à R&D plus grandes et plus fortes !Si vous avez besoin d'en savoir plus sur les produits de la chambre d'essai environnemental, vous pouvez rechercher sur le site officiel de "Lab Companion", n'hésitez pas à nous contacter pour consultation, nous pouvons vous fournir des conseils et des orientations techniques professionnels individuels. .
Chambre d'essai de dépistage du stress environnemental ESSLe système d'alimentation en air entièrement horizontal de droite à gauche avec un grand volume d'air est adopté, de sorte que tous les wagons d'échantillons et échantillons soumis à l'essai soient chargés et divisés, et que l'échange thermique soit effectué de manière uniforme et rapide.◆ Le taux d'utilisation de l'espace de test atteint 90 %◆ La conception spéciale du « système de flux d'air horizontal uniforme » de l'équipement ESS est le brevet de la mesure Ring.Numéro de brevet : 6272767◆ Equipé d'un système de régulation du volume d'air◆ Circulateur à turbine unique (le volume d'air peut atteindre 3 000 ~ 8 000 CFM)◆ Structure de type plancher, chargement et déchargement pratiques des produits testés◆ Selon la structure particulière du produit testé, le boîtier adapté à l'installation est utilisé◆ Le système de contrôle et le système de réfrigération peuvent être séparés du boîtier, ce qui est facile à planifier ou à réduire le bruit en laboratoire◆ Adopter le contrôle de la température de l'équilibre froid, plus d'économie d'énergie◆ L'équipement adopte la vanne de réfrigération Sporlan de la plus grande marque au monde avec une fiabilité élevée et une longue durée de vie◆ Le système de réfrigération de l'équipement adopte un tuyau en cuivre épaissi◆ Toutes les pièces électriques solides sont constituées de fils résistants aux hautes températures, ce qui offre une sécurité plus élevée.
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